Descrição do concurso
General requirements:
This tender concerns the supply of a mask aligner to be used with 200 mm diameter wafers.
Technical requirements:
The new mask aligner should comply with the following requirements:
— the mask aligner should be a semi-automatic (wafers loaded by the operator) or fully automatic tool (wafers loaded and unloaded from a cassette),
— the mask aligner must be able to handle 200 mm diameter Si wafers with thicknesses of 750μm,
— the mask aligner should be able to write on the full surface of the si wafers,
— the mask aligner should be capable of performing exposures in several different modes including hard contact, soft contact, proximity (with adjustable distance between mask and wafer in 1μm steps) and vacuum contact,
— the mask aligner should be able to write features with dimensions down to 2μm (including lines, circles, ellipses, squares and rectangles) without shape distortions on the full wafer,
— the mask aligner should be capable of automatically aligning the mask blank with respect to the wafer using alignment marks defined in previous lithography and pattern transfer steps,
— the mask aligner should be capable of aligning a mask blank with respect to alignment marks in a wafer placed either on the top side or on the bottom side of the wafer. I.e., the tool should be capable of performing both top side alignment and bottom side alignment,
— the overlay accuracy between 2 layers exposed in the same tool should be equal or better than 1μm on the full wafer,
— the mask aligner should be capable of using mask blanks of 9 inch x 9 inch made of quartz or soda-lime glass,
— for compatibility with the masks currently available at INL, the mask aligner should be capable of handling mask blanks of 8 inch x 8 inch made of quartz or soda-lime, even if the exposure will not be made on the full wafer surface in this case,
— the mask aligner optics should be capable of resolving features down to 1μm,
— besides conventional ocular lens, the mask aligner should have a screen (ideally larger than 17 inch) displaying the images captured by the optics.
The system should be capable of capturing pictures.
Improvements to the offer:
Any additional improvement to the offer, not contemplated in the previous requirements, and including additional modes of operation, experimental modes of operation or opportunities to explore additional modes of operation in collaboration with the equipment manufacturer will be positively valued.
Trade-in option:
In order to reach the target price, the bid can contemplate the possibility of a trade-in option. I.e, the bidders applying to this tender have the option of making an offer for the existing mask aligner installed at INL. If accepted, the mask aligner installed at INL will be delivered to the bidder after the installation of the new mask aligner. The interested bidder can ask INL for any details required to value the existing mask aligner.
Demonstration:
A demonstration of the mask aligner capabilities should be made. This demonstration can consist of pictures that best approach a demonstration of the capability of the mask aligner achieving an overlay error <=1 μm with features approaching 2μm. This demonstration can be made using suitable existing mask of the bidder. An example of such mask is an overlay of ellipses of 10μm x2μm on top of ellipses of 12μm x 4μm. Other shapes (rectangles, circles, squares, etc.) and sizes approaching the limits stated in this tender are acceptable.
Product safety.
CE mark, interlocked safety cover.
Maximum price.
Maximum price (P0) is 400 000,00 EUR (Four Hundred Thousand Euros) (including handling, transportation, installation, training and warranty) after subtracting any trade-in offer made for the existing mask aligner currently installed at INL.
Target delivery time:
Target delivery time is 8 months from contract signature.